| DIS Inc Duetto Integrated Systems Inc New York |
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| DIS Inc New York USA |
| PRS-77 Pinless Registration System |
| Precise Visual Lay-up, Alignment and Welding of Multilayers |
The PRS-77 Pinless Registration System allows for pinless
lamination of multilayers and sequential lamination build up
technology. Three different processes take place in one unit;
lay-up, layer to layer alignment and welding. This process
eliminates the added tolerances associated with pin lamination,
rivet and thermal bonding systems.
lamination of multilayers and sequential lamination build up
technology. Three different processes take place in one unit;
lay-up, layer to layer alignment and welding. This process
eliminates the added tolerances associated with pin lamination,
rivet and thermal bonding systems.
| SmartWeld Technology |
Once aligned, the material is welded together utilizing the patented
welding system developed by DIS Inc. The system consists of an
upper and lower weld head per station. The complete weld cycle is
controlled similar to a lamination press cycle. The different
parameters are set, such as maximum temperature, temperature
ramp rate, hold (soak) time, cooling time and pressure. Each weld
station is independently controlled for maximum flexibility.
welding system developed by DIS Inc. The system consists of an
upper and lower weld head per station. The complete weld cycle is
controlled similar to a lamination press cycle. The different
parameters are set, such as maximum temperature, temperature
ramp rate, hold (soak) time, cooling time and pressure. Each weld
station is independently controlled for maximum flexibility.
| Worldwide patent pending |
| Innerlayers held in position by Clamps & Center Positioning Platen prior to welding operation |
| Mechanical Tolerance Buildup is Eliminated |
Mechanical tolerance variations such as , tooling hole size,
lamination plate bushing locations and pin size are eliminated.
Utilizing existing technology and stringent tooling practices will
guarantee at best only 2 to 3 mils (50-75 micron) of layer to layer
registration. The PRS 77 will align innerlayers to within +/- 0.7
mils (17 micron). The system will process all panel sizes from 12” x
18” to 24” x 30” (305 x 455mm to 610 x 760mm).
lamination plate bushing locations and pin size are eliminated.
Utilizing existing technology and stringent tooling practices will
guarantee at best only 2 to 3 mils (50-75 micron) of layer to layer
registration. The PRS 77 will align innerlayers to within +/- 0.7
mils (17 micron). The system will process all panel sizes from 12” x
18” to 24” x 30” (305 x 455mm to 610 x 760mm).