DUETTO INTEGRATED SYSTEMS INC

PRS-77D Pinless Registration System with Double Bonding Stations

The PRS 77 Pinless Registration System allows for pinless lamination of multilayers and sequential lamination build up technology. Three different processes take place in one unit, layup, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination. The double bonding station increases the productivity, as one multilayer is in the alignment station, another aligned multilayer is being bonded simultaneously

Mechanical Tolerance Buildup is Eliminated

PRS-77D  Pinless Registration System with Double Bonding Stations (Worldwide Patent Pending)

Mechanical tolerance variations such as , tooling hole size, lamination plate bushing locations and pin size are eliminated. Utilizing existing pin lamination technology and stringent tooling practices will guarantee at best only 2 to 3 mils (50-75 micron) of layer to layer registration.   The  PRS 77 will align innerlayers to within   +/- 0.7 mils (17 micron). The system will process all panel sizes from  14” x  18”  to  24” x  24”   (355 x 455mm  to 610 x 610mm).

These are some of the process improvements that are quickly realized:

No need to purchase rivets No need to tool prepreg or foil, foil can be used on a roll, thus less handling. No double handling of innerlayers, they will only be handled at lay-up. No need to punch innerlayer tooling No need to retool targets on phototools, works with all existing targets. No need for lamination pins or tooled lamination and separator plates