DUETTO INTEGRATED SYSTEMS INC

PRS-77 Pinless Registration System

The PRS 77 Pinless Registration System allows for pinless lamination of multilayers and sequential lamination build up technology. Three different processes take place in one unit, layup, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination. The tooled bonding system allows for controlled bonding areas, this ensures a good uniform bond. This system will not deform layers as do standard bonding systems.

Mechanical Tolerance Buildup is Eliminated

Mechanical tolerance variations such as , tooling hole size, lamination plate bushing locations and pin size are eliminated. Utilizing existing pin lamination technology and stringent tooling practices will guarantee at best only 2 to 3 mils (50-75 micron) of layer to layer registration.   The  PRS 77 will align innerlayers to within   +/- 0.7 mils (17 micron). The system will process all panel sizes from  12” x  18”  to  24” x  30”   (305 x 455mm  to 610 x 760mm).

PRS-77  Pinless Registration System (Worldwide Patent Pending)

These are some of the process improvements that are quickly realized:

No need to purchase rivets No need to tool prepreg or foil, foil can be used on a roll, thus less handling. No double handling of innerlayers, they will only be handled at lay-up. No need to punch innerlayer tooling No need to retool targets on phototools, works with all existing targets. No need for lamination pins or tooled lamination and separator plates