Registration Bonding System
The MB Registration Bonding System allows for lamination of multilayers and sequential lamination build up technology. Three different processes take place in one unit, lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with riveting and pin lamination.
The bonding head assemblies of the MB are tooled. The bond areas of the innerlayers are clamped during the heating and cooling cycles, this keeps the resin from flowing out of the bond area thus resulting in a stronger bond. By tooling this area the system has virtually eliminated the problem with bumps as seen on other bonding systems.
Utilizing this system eliminates the added cost of rivets, rivet tooling, lamination pins, tooled lamination and separator plates.
The MB will process all panel sizes from 11” x 15” to 21” x 24” (280 x 380mm to 533 x 610mm). The system can also be configured to customer specific pin-up location tooling.
Registration Bonding System
Lay-up table extended